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Signal Integrity Challenges in Modern AI Computers: Package and PCB Materials

Fri, Nov 6, 2:00 AM UTCEngineering Center, 1111 Engineering Drive, Boulder, CO
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at://did:plc:a3wwi5pub22p2kofmult2d5w/community.lexicon.calendar.event/3mxjx55kt5d22

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  • Signal Integrity Challenges in Modern AI Computers: Package and PCB Materials and Signal Integrity Challenges in Modern AI Computers: Package and PCB Materials

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at://did:plc:a3wwi5pub22p2kofmult2d5w/coop.lexicon.draft.provenance/ctoy4vkymlrd25ywm47i4bvt7xeipyl5ncfhzr4riikz4h4enqva